Trends›Power is the binding constraint

Power is the binding constraint

By 2027 electrical power supply and thermal dissipation, not chip or memory supply, become the binding constraint on AI-datacentre scale-up, shifting the bottleneck from the fab to the grid and the cooling loop.

94 confidence, computed 23 Oct 2026
  • Technical
  • High weight
AprJulOct94nowforagainst Jul94nowforagainst
Fig. 1The evidence leans for, overwhelmingly by weight, and the newest evidence points the same way.
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What rests on thismarkets it underwrites or threatens
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