Screening individual die as good BEFORE they are committed to an expensive multi-die 2.5D/3D package (one bad die scraps a package worth thousands). Made mandatory by chiplet/heterogeneous integration; a binding yield gate for AI-die packaging.
Screening individual die as good BEFORE they are committed to an expensive multi-die 2.5D/3D package (one bad die scraps a package worth thousands). Made mandatory by chiplet/heterogeneous integration; a binding yield gate for AI-die packaging.