Manufacturing
Lithography, packaging, equipment, foundry, deposition. How chips are made — and where the binding constraints on every other layer live.
Lithography
EUV (including high-NA), DUV immersion, e-beam, maskless multi-beam, nanoimprint, photoresists, two-photon polymerisation, xolography. The patterning layer that gates every other layer of semiconductor scaling.
Packaging
3D-IC stacking, CoWoS, FOWLP, hybrid bonding, co-packaged optics, photonic wire bonding, TSV, glass interposers, substrates. Where Moore's Law has actually been alive for the last decade.
Equipment & processes
ALD, MOCVD/MBE, PVD, CMP, iCVD, etch tools, metrology, wafer-handling, additive manufacturing, diamond-turning. The physical processes that turn substrates into devices.
Foundry & design
Foundry services, multi-project wafer (MPW), OSAT, PDKs, EDA tools, specialty foundries. The commercial machinery between a chip design and an actual wafer.