A front-end doping module that fires ions into the wafer to set electrical properties; critical for SiC/power and CMOS. A 2-firm duopoly (Applied Materials + Axcelis). In-mandate by layer but acquirer-captured at the tool level, like the rest of the deposition/front-end toolchain.
Concept stub created 2026-06-03 from the semi+photonics gap-map research (segment backfill).