Materials
Substrates, functional layers, advanced materials, coatings. What chips are made of — silicon and far beyond.
Substrates
Silicon, SiC, GaN, GaAs, InP, Ge, diamond, sapphire. Plus 2D materials — graphene, hBN, TMDs — and the compound semiconductor family. What the device is built on.
Functional layers
Barium titanate (BTO), thin-film lithium niobate (TFLN), scandium aluminium nitride, ferroelectric HfO₂, polymer waveguides, piezoelectric and topological materials. Engineered films that do real work — modulate light, store charge, transduce energy.
Advanced materials
Graphene and its 2D cousins, MXenes, carbon nanotubes, chalcogenide glasses, ceramics, novel thin films. The post-silicon material zoo — most of it not yet at production scale.
Coatings & interfaces
Anti-reflection, hydrophobic and oleophobic coatings, optical coatings, diffusion barriers. The thin films at the boundary between a device and its environment.