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Test & metrology

Defect inspection, CD/overlay metrology, wafer sort, parametric test, final test, burn-in. Where yield is measured and margins are made.

6 concepts in this cluster

Burn-in & reliability (process step)

+2 sources in 30d

Defect inspection & review (process step)

+2 sources in 30d

Final test (ATE) (process step)

+2 sources in 30d

Metrology (CD, overlay, film, OCD) (process step)

+2 sources in 30d

Parametric / in-line E-test (process step)

+2 sources in 30d

Wafer sort / probe (process step)

+2 sources in 30d