Frontend

Oxidation, lithography, etch, implant, deposition, CMP, the transistor module, damascene interconnect. The wafer's thousand-step gauntlet.

20 concepts in this cluster

Annealing / rapid thermal processing (process step)

+2 sources in 30d

Atomic layer deposition (ALD) (process step)

+3 sources in 30d

Barrier / liner / seed deposition (process step)

+2 sources in 30d

Chemical-mechanical planarisation (CMP) (process step)

+2 sources in 30d

Contact & middle-of-line (silicide, contact fill) (process step)

+2 sources in 30d

Copper electroplating (ECD) (process step)

+2 sources in 30d

CVD / PECVD deposition (process step)

+2 sources in 30d

Damascene patterning (via/trench) (process step)

+2 sources in 30d

Epitaxial deposition (epi) (process step)

+2 sources in 30d

Ion implantation (doping) (process step)

+2 sources in 30d

Low-k dielectric (IMD) deposition (process step)

+2 sources in 30d

Photolithography (coat / expose / develop) (process step)

+2 sources in 30d

Photomask manufacturing (process step)

+2 sources in 30d

Plasma / dry etch (process step)

+2 sources in 30d

PVD / sputtering (process step)

+2 sources in 30d

Thermal oxidation & gate dielectric (process step)

+2 sources in 30d

Transistor module (FinFET / GAA nanosheet) (process step)

+2 sources in 30d

Wafer cleaning & surface prep (process step)

+2 sources in 30d

Wafer foundry / fabrication services (process step)

+2 sources in 30d

Wet etch / chemical surface prep (process step)

+2 sources in 30d