TMDs (MoS2, WSe2)

last updated 2026-08-31 · +3 sources in last 30d
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Transition metal dichalcogenides such as MoS2 and WSe2 are layered semiconductors that remain semiconducting at a single three-atom-thick layer, making them candidate channel materials for post-silicon transistors and a versatile substrate for stacked photonic, ferroelectric and spintronic devices; the electronics case now rests on real scaled devices, while most of the exotic quantum claims remain first-principles theory.

Summary

Transition metal dichalcogenides (TMDs) are compounds of the form MX2, where M is a transition metal (Mo, W, V-alloyed Mo) and X a chalcogen (S, Se, Te). They form covalently bonded triple layers held together by weak van der Waals forces, so single layers can be isolated or grown and then stacked without lattice matching. Monolayers have a direct band gap, strong spin-orbit coupling and inequivalent K/K’ valleys, which is the origin of both the transistor interest and the valleytronics interest. The polytype matters as much as the chemistry: 2H is semiconducting, 1T’ metallic, and 3R stacking breaks inversion symmetry and produces out-of-plane sliding ferroelectricity in bilayers.

Beyond logic, TMDs are being used as a substrate-like platform. Transfer printing without lattice mismatch motivates many-junction photovoltaics, although a conservative TMD gap window of 1.0 to 2.1 eV caps the detailed-balance efficiency near 63.4% at 50 junctions under full concentration, against 84.5% for an unconstrained ladder, with an experimentally plausible five-junction ladder identified. Subwavelength TMD films generate polarisation-entangled photon pairs by spontaneous parametric down-conversion without bulk phase matching, and periodic poling is being used to escape the coherence-length limit on efficiency. Proximity engineering supplies further knobs: a ferromagnetic V2O3 monolayer induces about 10.41 meV of zero-field valley splitting in WSe2, equivalent to roughly 10 T, with a Curie temperature of 500 K in calculation. The deciding parameters across all of this are the same three: growth uniformity and defect density, contact and doping control, and stacking or twist-angle fidelity.

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Assessment drafted 2026-08-31 from up to 18 KB sources using the technology-scorecard framework; scores are a draft read pending review.

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