GaN

last updated 2026-05-04 · +32 sources in last 30d

Physics / mechanism

Gallium nitride is a wide-bandgap (3.4 eV) III-V semiconductor. High electron mobility (~2000 cm²/V·s in HEMT structures via 2DEG at AlGaN/GaN interface), high breakdown field (~3.3 MV/cm), and high saturation velocity make it dominant in RF power amplifiers and fast power conversion. Key figures of merit: Baliga FOM ~900× silicon for power; Johnson FOM favors RF up to ~100 GHz. Production sits on 6-inch SiC or silicon substrates; 8-inch GaN-on-Si is qualifying at several fabs. ON-resistance for 650 V devices now reaching 50–150 mΩ·mm², with switching frequencies pushing 1–10 MHz in production designs.

Competitive landscape

GaN competes directly with SiC in power electronics above ~200 V and with LDMOS in RF below ~4 GHz. At lower voltages (<200 V) it displaces silicon superjunction MOSFETs. Above 1.2 kV, SiC currently holds the edge on yield and ecosystem maturity.

MaterialVoltage sweet spotFrequencyMaturity
GaN100–650 V, RF to 100 GHzHighMid
SiC650 V–10 kVMediumHigh
Si LDMOS<300 V<4 GHzVery high

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