Cryo CMOS

last updated 2026-05-04

Physics / mechanism

Cryo CMOS refers to standard CMOS logic and mixed-signal circuits operated at cryogenic temperatures, typically 4 K (liquid helium) or 77 K (liquid nitrogen), to control and read out quantum processors co-located in dilution refrigerators. At 4 K, carrier freeze-out, threshold voltage shifts (+100–200 mV), reduced mobility (partially offset by phonon scattering suppression), and altered subthreshold slope change device behavior materially. Key parameters: power dissipation per qubit control channel must stay below ~1 mW at 4 K to avoid heat budget violations in dilution units (budget: 1–2 W at 4 K stage). State of the art: Intel Horse Ridge II, imec/SiGe demonstrators, and academic designs in 22 nm FD-SOI and 40 nm bulk nodes achieve multi-channel qubit control with sub-mW/channel targets approaching viable scale.

Competitive landscape

The primary alternative is room-temperature classical electronics with coaxial cables running into the fridge—simple but fundamentally unscalable past ~100 qubits due to wiring density and heat load. SiGe HBT bipolar processes offer better cryo noise performance but higher static power. III-V HEMTs (InP, GaAs) operate cleanly at 4 K with superior noise figures but lack integration density. FD-SOI (GlobalFoundries 22FDX, ST 28 nm) is a leading candidate: back-gate tunability partially compensates threshold voltage shift, and the partially-depleted body reduces kink effect.

ApproachTemp rangeIntegration densityPower/channel
Cryo CMOS (bulk/FD-SOI)4–77 KHigh~0.5–5 mW
SiGe HBT4–77 KMedium~2–10 mW
InP HEMT4 KLow<0.1 mW

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