Packaging

Backgrind, dicing, die attach, bonding, molding, substrates, bumping, 2.5D/3D/fan-out, OSAT. The back end that became the front line.

14 concepts in this cluster

Advanced packaging: 2.5D (CoWoS / EMIB / interposer) (process step)

+2 sources in 30d

Advanced packaging: 3D stacking & hybrid bonding (process step)

+2 sources in 30d

Advanced packaging: fan-out (InFO / FOWLP / FOPLP) (process step)

+2 sources in 30d

Die attach / pick-and-place (process step)

+2 sources in 30d

Flip-chip bumping (C4 / Cu pillar / microbump) (process step)

+2 sources in 30d

Lead frame manufacturing (process step)

+2 sources in 30d

Marking, tape & reel, final inspection (process step)

+2 sources in 30d

Molding / encapsulation (process step)

+2 sources in 30d

OSAT (outsourced assembly & test) services (process step)

+2 sources in 30d

Package substrate manufacturing (ABF / glass) (process step)

+2 sources in 30d

Solder ball attach / BGA (process step)

+2 sources in 30d

Wafer backgrinding / thinning (process step)

+2 sources in 30d

Wafer dicing / singulation (process step)

+2 sources in 30d

Wire bonding (process step)

+3 sources in 30d