Memory
DRAM, HBM, NAND — and the emerging layer: MRAM, RRAM, PCM, photonic, memcapacitor. The memory wall is where AI scaling breaks; this is where it gets repaired.
Mainstream memory
DRAM, HBM, SRAM, NAND, MRAM, FeRAM. The memory a chip designer can actually pick today — including the increasingly-mature non-volatile options (MRAM, FeRAM) that have crossed into productisation.
Emerging memory
RRAM, PCM, memcapacitor, photonic memory, storage-class memory, in-memory computing. The watchlist — substrates and architectures still proving they can scale.